Fabio, I did the footprints for CC111xFx devices and are working very well, however I used not a very normal way.
if you want I can send to you the modules.
On Thu, Apr 12, 2012 at 3:41 PM, Fabio Varesano
<fabio.varesano@...> wrote:
?
Hi,
I'm developing a board with a CC430 which comes in a QFN64 package
with a bottom pad which has to be connected to GND and full of vias
for head dissipation. Please see the following screenshot:
How would you design such bottom pad with KiCad? AFAIK I simply can't
place vias on pads...
Thanks,
Fabio
