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Thermal vias under bottom pad of QFN64

 

Hi,

I'm developing a board with a CC430 which comes in a QFN64 package with a bottom pad which has to be connected to GND and full of vias for head dissipation. Please see the following screenshot:


How would you design such bottom pad with KiCad? AFAIK I simply can't place vias on pads...

Thanks,

Fabio
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