At work they sometimes put boards with
paste, without parts, in a small closed plastic box overnight (end
of shift to start of shift) and it works out ok. They usually
store it in a dry nitrogen box, but I don't think that really
matters too much.
I am planning the build of an Ensemble RX and I am
thinking of trying the griddle-heat gun reflow method to
install the SMT parts. As far as blocking out time to
apply the solder paste and place individual parts, how
long can one let the applied parts stand without reflow? I
would like to break the placement process up over several
days but I am worried that the solder paste will separate
or otherwise degrade if I don't place all the parts and
reflow them in the same session. Can the process be broken
up over a period of days or even a couple of weeks without
ruining the already placed parts??