I have uploaded a number of modules, including QFN devices, here:
Some are for projects that never got started (or the chip changed), but the others have been used successfully. The bottom line is check, check, and check again before using *any* footprint. Watch out in particular for QFN packages that have ever-so-slightly different pin pitches - the IPC names I've used incorporate the pin pitch in the name.
Regards,
Robert.
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On 12/04/2012 20:41, Fabio Varesano wrote:
Hi,
I'm developing a board with a CC430 which comes in a QFN64 package
with a bottom pad which has to be connected to GND and full of vias
for head dissipation. Please see the following screenshot:
How would you design such bottom pad with KiCad? AFAIK I simply can't
place vias on pads...
Thanks,
Fabio
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