开云体育

I would like to increase trace and device isolation.? i can't find advice on how to do this in the PCBGCODE Manual, so assume this must be something that can be done in Eagle.

It looks as though one cuts the initial isolation passes with the etcher, than mills away adjacent copper with a milling tool.

Where should I look to read up on this?

Additionally, I've been tinning my boards with MG Chemicals Liquid Tin.? Works well if copper is properly sanded with 400 grit and degreaed with actone - IPA might be better.

Why not do same thing with via rivets?

john

The answer is in the pcb-gcode-setup ulp.
See below
This is my setup for a 0.2mm milling tool (no chemical etching in my work). I set the minimum to less than the cutting tool diameter to ensure a clean finish.

So. 0.15mm minimum means that gaps down to 0.15mm will be milled.? ?1.2mm maximum means that multiple passes will be made until an area 1.2mm wide will be milled away from all traces.? Step size of 0.15mm means that each pass of the tool is 0.15mm further away from the traces than the previous pass.

I would be interested to know if anyone has figured out how to do this with a CNC UV laser/chemimilling? process.