On 27 January 2011 15:31, dennevi <dennevi@...> wrote:
Thank you both for the quick and helpful answers!
I'll try my workaround and have a look in a gerber viewer tomorrow.
Do you believe it will work if I have pads only in L1 and L6 and connect a trace to the plated hole in L3, even if there is no pad present in that layer? Or do I need to make all connections to the plated hole in L1 or L6?
Kind regards
Albin, Sweden
Hi Albin,
In KiCad it is impossible to connect to a TH plating that doesn't have
a pad on the same layer as the trace as the pads are present on all
copper layers; Actually, even though KiCad does not offer the best
solution - which is to support pad stacks, connecting a track to a TH
plating without a copper pad is something that CAD software should
prevent anyway. You would never be able to have a reliable connection
to a TH plating without a pad on the layer you want to connect.
One of the main reasons is drilling accuracy, but there are other
factors involved too.
Here is some quick info that is worth a quick scan read at least:
Normal operation for the CAD software supporting a full pad stack
would be to have no pad present on the inner layers of the TH plating
(Front and Back layers MUST have pads on to support the plating), then
when a track is connected to the TH plating, a pad is added to the
same layer as the track.
I hope this makes sense for you.
Best Regards,
Brian.
