On 06/06/2012 14:26, aurelcristescu wrote:
Hello.
I am new to Kicad and I did not find a proper way to resolve these
two things:
1) Place thermal vias under a component to transfer the heat to other
plane layers (for example connect a QFN with GND pad underneath to an
burrier GND plane)
2) Place ground stiching vias to connect TOP and
BOTTOM GND layers (like in RF routing).
First create two ground zones as required. Then start laying a track at any component pad that is connected to ground. At regular intervals place a via and carry on tracking. The ground track will switch from one layer to the other. Don't return to the start point. Finally fill your zones (I usually just run the DRC to do this).
Regards,
Robert.
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