Hello.
I am new to Kicad and I did not find a proper way to resolve these two things:
1) Place thermal vias under a component to transfer the heat to other plane layers (for example connect a QFN with GND pad underneath to an burrier GND plane)
2) Place ground stiching vias to connect TOP and BOTTOM GND layers (like in RF routing).
For issue 1 I have tried to place in footprint definition extra pads on the QFN thermal pad (to simulate vias) but they are connecting to GND plane using thermal contours.
For issue 2 I have tried to select "Add trace" an then "Place via" and is ok (a GND via will place wherever I like) until I do a UNDO which will remove from all vias GND net association (vias will not have anymore a net associated with them).
Do you have any better recommandation for these problems?
Thanks in advance.
